Arradiance is developing a high-throughput, high-resolution
alternative to optical lithography that is based on its
patented MCA-Equalized Source Array (MESA). MESA is a
massively parallel, solid state, ultra-compact, cold-cathode
e-beam source. The complete MESA e-beam source assembly is
only 25mm high, operates reliably at low current, and
delivers stable and “bright” e-beams. The core technology
(patented) is the combination of an array of cold-cathode
field emitters with an array of microchannel amplifiers –
all made from silicon using proven CMOS and MEMS process
technologies. The basic MESA architecture consists of three
core components:
● the cold-cathode field emitter array (FEA)
● the silicon microchannel amplifier array (MCA)
● the electron beam lens array (EBLA)
In the FEA, emitters are arranged in a grid on 500 micron
centers so that a 50 mm x 50 mm area contains 10,000 emitter
clusters (each an individual “channel”). Each emitter
cluster is ~25 microns in diameter consisting of 19 emitting
tips. The minimum distance between adjacent tips is 8
microns.
The purpose of the MCA is to amplify the output of each of
the emitter clusters in the FEA by two or three orders of
magnitude. The amplification provided by the MCA is
fundamental to the MESA innovation and to its expected high
reliability. The MCA amplification allows the emitters to be
operated at low current which in turn increases emitter life
by several orders of magnitude. This addresses a major
problem that has plagued field emitter-based systems
historically: when run at useful currents, they degrade
quickly. In MESA, the burden of providing useful current
rests on the highly robust MCA. The massively parallel
nature of this system also addresses the low throughput
problem that has plagued traditional e-beam systems in the
past.
The MCA is operated in its saturated regime to achieve noise
suppression coming from the emitters and to deliver uniform
current output by each channel (that is, uniform to within
the dosage parameters of the e-beam resist being exposed).
Appropriate uniformity throughout all channels of the MCA is
essential.
Each FEA emitter is paired with a “channel” in the MCA.
Thus, a 50 mm x 50 mm area of the MCA also contains 10,000
“channels” on 500 micron centers. The result is a massively
parallel array of “bright” e-beam sources that can be
focused directly onto a wafer surface through an array of
electrostatic lenses (the EBLA). The focused beams then
directly expose resist on the surface of the wafer. With
all emitters “on”, the beams can write lines across the
entire active area if the wafer is moved 500 microns (the
center to center spacing of each channel).
The MESA system offers high resolution, large depth of
focus, and the ability to write features from 90nm down to
16nm – covering the span of the ITRS roadmap. MESA offers
the following advantages and the potential to deliver all of
the requirements for lithography:
● High throughput rivaling production optical steppers
● Extensible throughout the ITRS roadmap – from 90nm to 16nm
● Scalable to any wafer size
● High resolution, large depth of focus
● Maskless operation
● Low cost of ownership
● Ultra-compact footprint – more “cluster tool”, less “stepper”
● Monolithic, solid state construction
● Manufacturability using standard MEMS and CMOS processes