Benchtop and floor-standing ALD systems, built for ease of use, low cost of ownership, and film reproducibility.

Two product families cover thermal and plasma-enhanced ALD and MLD, from a single-bench R&D tool to an expanded-capability platform. Both are engineered around predictable chemistry and a service relationship that lasts.

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Specifications side-by-side.

Final, configuration-specific specs are confirmed on each product’s datasheet and in your quote.

SpecificationGEMStarPRIME
Process typeThermal ALD/MLD; plasma-enhanced ALD/MLD (XT-P: 300 W air-cooled ICP)Thermal & plasma-enhanced ALD/MLD; flow-through & exposure modes
FootprintBenchtop — 32 × 24 × 11 in (W × L × H), < 150 lb; glovebox-compatibleFloor-standing — 36.7 × 65.3 × 74.8 in (W × L × H)
Reactor temperatureTwo zones up to 300 °C ± 1 °C (450 °C optional)Thermal & plasma-enhanced; configurable
Substrate handlingUp to 200 mm wafers (150/100 mm options); high-aspect-ratio powders & 3D parts; batch cassettes2D wafers & 3D particles/objects; up to 20 × 200 mm wafers or 210 × 210 mm panels
Chamber capacitySingle-substrate & batch benchtop reactor≈ 4× the GEMStar XT chamber volume
Precursor manifoldSingle/dual 200 °C manifold zones; 4 (S)/8 (D) high-speed ALD valve ports; Pulsed Vapor Push for low-vapor-pressure precursors; up to 4–6 DOT-certified 150 mL bottlesConfigurable precursor sources (PLATINUM up to 15); supports extremely low-vapor-pressure materials; standard metrology port
CoolingAir-cooled (incl. plasma head); 110–120 VAC, 20 AFully air-cooled — no chilled water required
VariantsXT-S/D, XT-R, XT-PVERDE, PLATINUM, Custom
Typical usersUniversity & corporate R&D labs; cluster tool configurations & production linesR&D scale-up & production

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