Benchtop and floor-standing ALD, PE-ALD, and MLD systems, built for ease of use, low cost of ownership, and film reproducibility.

Both GEMStar and PRIME product families run thermal ALD, plasma-enhanced ALD (PE-ALD), and molecular layer deposition (MLD). Choose the family on chamber volume and substrate format, then the model on the deposition mode that dominates your work.

Deposition modes

Which mode, which machine.

All three modes run on both families, so your choice is form factor and scale, not process. The Technology page explains how each method works.

Thermal ALD

Runs on every model. On the bench, two zones hold to within 1 °C up to 300 °C (450 °C optional), and the Pulsed Vapor Push manifold keeps low-vapor-pressure precursors repeatable.

Plasma-enhanced ALD (PE-ALD)

GEMStar XT-P uses a 300 W air-cooled direct ICP source, and XT-R is PE-ALD-upgradeable, so a thermal purchase converts later. Both PRIME models run PE-ALD at larger chamber volume.

Molecular layer deposition (MLD)

For organic and hybrid films. GEMStar covers MLD on the bench; PRIME VERDE is the first commercially available thermal and plasma-enhanced MLD system, built around organic precursor handling.

Compare

Specifications side-by-side.

Final, configuration-specific specs are confirmed on each product’s datasheet and in your quote.

SpecificationGEMStarPRIME
Process typeThermal ALD, PE-ALD, and MLD. Plasma via the XT-P’s 300 W air-cooled direct ICP; XT-R is PE-ALD-upgradeable.Thermal ALD, PE-ALD, and MLD; flow-through & exposure modes. VERDE leads on MLD, PLATINUM on high-source-count ALD.
FootprintBenchtop: 32 × 24 × 11 in (W × L × H), < 150 lb; glovebox-compatibleFloor-standing: 36.7 × 65.3 × 74.8 in (W × L × H)
Reactor temperatureUp to 300 °C ± 1 °C (450 °C optional)Up to 300 °C ± 1 °C (450 °C optional)
Substrate handlingUp to 200 mm wafers (150/100 mm options); high-aspect-ratio powders & 3D parts; batch cassettes2D wafers & 3D particles/objects; up to 20 × 200 mm wafers or 210 × 210 mm panels
Chamber capacitySingle-substrate & batch benchtop reactor≈ 4× the GEMStar XT chamber volume
Precursor manifoldSingle/dual 200 °C manifold zones; 4 (S)/8 (D) high-speed ALD valve ports; Pulsed Vapor Push for low-vapor-pressure precursors; up to 4–6 DOT-certified 150 mL bottlesConfigurable precursor sources (PLATINUM up to 15); supports extremely low-vapor-pressure materials; standard metrology port
CoolingAir-cooled (incl. plasma head); 110–120 VAC, 20 AFully air-cooled, no chilled water required
VariantsXT-S/D, XT-R, XT-P, CustomVERDE, PLATINUM, Custom
Typical usersUniversity & corporate R&D labs; cluster tool configurations & production linesR&D scale-up & production

Tell us about your process.

Substrate, target material, deposition mode (thermal ALD, PE-ALD, or MLD), temperature range, throughput. Share the basics and a specialist will recommend a configuration and a quote.

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